THICKNESS CONTROL VARIATION

摘要

Embodiments described herein generally relate to an apparatus for processing substrates having varying thicknesses. In kerfless substrate processes, a template may be reused many times to form substrates. Many deposition processes affected by the flow dynamics of process gases are generally sensitive to many variables, such as thickness of the substrate being processed with relation to a susceptor surface within which the substrate may be disposed. The substrate may be disposed in a recess such that a top surface of the substrate and a surface of the susceptor are substantially coplanar. Thus, film deposition uniformity may be improved.