摘要 |
<p>The present invention relates an apparatus for supplying tablets which is used to mold semiconductor devices mounted on a substrate. According to the present invention, a tablet supplying apparatus includes at least one tablet supply module and at least one receiving chamber. The tablet supply module supplies tablets used to mold semiconductor devices to at least one molding device. The receiving chamber receives the tablet supply module therein such that the tablet supply module is spaced apart from the molding device.</p> |