发明名称 LASER DRILLING METHOD
摘要 PROBLEM TO BE SOLVED: To find conditions under which drilling is performed to a glass substrate by using only a high output carbonic acid gas laser that is considered impossible to do in the past.SOLUTION: A laser processing device includes: an X-Y table (51) on which a work-piece (50) is placed, the X-Y table which may be driven in X and Y directions; a carbon dioxide gas laser oscillator (8); a modulator (21) which modulates a laser (9) emitted from the laser oscillator (8) into a fast speed laser to make the laser into a pulse laser (9k); and an optical system which condenses the pulse laser on the work-piece (50). In order to achieve the above object, the laser processing device is used in a state where the power density of the pulse laser, the pulse period, the pulse width, and the total pulse number are respectively set to 7 MW/cm, 3 to 5 μs, 2 μs, and 20 to 21.
申请公布号 JP2015006677(A) 申请公布日期 2015.01.15
申请号 JP20130132264 申请日期 2013.06.25
申请人 VIA MECHANICS LTD 发明人 MATSUMOTO SOTA;ITO YASUSHI;SAEKI ISATERU
分类号 B23K26/00;B23K26/08;B23K26/382;C03C23/00;H01S3/00;H01S3/10 主分类号 B23K26/00
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