| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer printed circuit board from a plurality of conduction or conductive and non-conduction or insulating layers or plies that are interconnected, especially pressed together.SOLUTION: After connecting partial plane layer, at least a subregion 11 thereof is removed, and in order to prevent adhesion of the subregion 11 to be removed, an anti-adhesive material 8 is bonded onto a layer 9 adjacent to the subregion to be removed according thereto. The anti-adhesive material 8 is formed of a mixture containing at least one metallic soap, preferably a parting agent based on the fatty acid salt of Al, Mg, Ca, Na and Zn, a binder, and a solvent. Consequently, the subregion to be removed can be removed easily and reliably after appropriate processing and/or processing step of a multilayer printed circuit board. Furthermore, an anti-adhesive material, and a method of manufacturing a multilayer printed circuit board are provided. |
