LASER PROCESSING APPARATUS, LASER IRRADIATION POINT CORRECTION METHOD, DRILLING PROCESSING METHOD, AND WIRING SUBSTRATE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a laser processing apparatus capable of improving correction accuracy.SOLUTION: A laser processing apparatus 10 comprises: a laser oscillator 12; galvanometer mirrors 14 and 15 scanning a laser beam L1 output from the laser oscillator 12; and a condensation lens 18 condensing the laser beams L1 output from the galvanometer mirrors 14 and 15. The laser processing apparatus 10 includes a table 20 that has a first region R1 in which a wiring substrate 30 to be drilled by the laser beam L1 output from the condensation lens 18 is mounted, and a second region R2 different from the first region R1. The laser processing apparatus 10 includes: a workpiece 40 mounted in the second region R2, and including the wiring substrate 30, a pattern 42 laminated on the substrate 30, and a film laminated on the substrate 30 so as to cover the pattern 42; and an imaging device 19 imaging the pattern 42.