发明名称 |
METHOD FOR FORMING THIN FILM PATTERN |
摘要 |
To provide a method for forming a thin film pattern 14 having a predetermined shape on a surface of a substrate 1 having an electrode formed in advance in a thin film pattern forming region, there are included the steps of: bringing a resin film 2, which transmits visible light, into close contact with the substrate 1; irradiating the thin film pattern forming region 11 on the substrate 1 with laser light L, thereby forming an opening pattern 21 having the same shape as the thin film pattern 14 in the film 2; forming the thin film pattern 14 in the thin film pattern forming region 11 on the substrate 1 through the opening pattern 21 of the film 2; and peeling off the film 2. |
申请公布号 |
US2015017321(A1) |
申请公布日期 |
2015.01.15 |
申请号 |
US201414500767 |
申请日期 |
2014.09.29 |
申请人 |
V TECHNOLOGY CO., LTD. |
发明人 |
KUDO Syuji;MIZUMURA Michinobu;KAJIYAMA Koichi;AZIZ Hany Maher;KAJIYAMA Yoshitaka |
分类号 |
H01M4/00 |
主分类号 |
H01M4/00 |
代理机构 |
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代理人 |
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主权项 |
1. A method for forming a thin film pattern having a predetermined shape on a surface of a substrate having an electrode formed in advance in a thin film pattern forming region, the method comprising the steps of:
bringing a resin film, which transmits visible light, into close contact with the substrate; irradiating the thin film pattern forming region on the substrate with laser light, thereby forming an opening pattern having the same shape as the thin film pattern in the film; forming the thin film pattern in the thin film pattern forming region on the substrate through the opening pattern of the film; and peeling off the film. |
地址 |
Yokohama-shi JP |