发明名称 METHOD FOR FORMING THIN FILM PATTERN
摘要 To provide a method for forming a thin film pattern 14 having a predetermined shape on a surface of a substrate 1 having an electrode formed in advance in a thin film pattern forming region, there are included the steps of: bringing a resin film 2, which transmits visible light, into close contact with the substrate 1; irradiating the thin film pattern forming region 11 on the substrate 1 with laser light L, thereby forming an opening pattern 21 having the same shape as the thin film pattern 14 in the film 2; forming the thin film pattern 14 in the thin film pattern forming region 11 on the substrate 1 through the opening pattern 21 of the film 2; and peeling off the film 2.
申请公布号 US2015017321(A1) 申请公布日期 2015.01.15
申请号 US201414500767 申请日期 2014.09.29
申请人 V TECHNOLOGY CO., LTD. 发明人 KUDO Syuji;MIZUMURA Michinobu;KAJIYAMA Koichi;AZIZ Hany Maher;KAJIYAMA Yoshitaka
分类号 H01M4/00 主分类号 H01M4/00
代理机构 代理人
主权项 1. A method for forming a thin film pattern having a predetermined shape on a surface of a substrate having an electrode formed in advance in a thin film pattern forming region, the method comprising the steps of: bringing a resin film, which transmits visible light, into close contact with the substrate; irradiating the thin film pattern forming region on the substrate with laser light, thereby forming an opening pattern having the same shape as the thin film pattern in the film; forming the thin film pattern in the thin film pattern forming region on the substrate through the opening pattern of the film; and peeling off the film.
地址 Yokohama-shi JP