| 摘要 |
PURPOSE: To improve throughput by making uniform the treatment for each wafer in a device for treating a semiconductor wafer. CONSTITUTION: A process chamber 1 is miniaturized so that one wafer 22 can be housed, the plasma density in the chamber is maple uniform to unify treatment, and an index mechanism 8 for positioning a plurality of process chambers l by rotating them while maintaining vacuum state and a chamber 13 for transportation for loading and unloading a wafer 22 into and from a plurality of positioned process chambers l while maintaining vacuum state are provided, at least, at two positions, thus carrying and treating the wafer 22 in parallel. |
