| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology capable of suppressing drops from being remained after cleaning processing and reducing residue when a surface of a substrate is cleaned with cleaning liquid while rotating the substrate.SOLUTION: By using a cleaning liquid nozzle 41 and a nitrogen gas nozzle 51, cleaning liquid and nitrogen gas are sequentially discharged to a center part of a wafer W while rotating the wafer W, and both nozzles are moved to a peripheral edge part side of the wafer W. Then, the discharge of the cleaning liquid is switched to a second cleaning liquid nozzle 43 that is set at a position deviated from a moving track of the first cleaning liquid nozzle 41. Both nozzles are moved to the peripheral edge side of the wafer W while performing the discharge of the cleaning liquid and the discharge of the gas, and each nozzle moves so as to gradually reduce a difference between a distance from the discharge position of the second cleaning liquid nozzle 43 to the center part of the wafer W and a distance from the discharge position of the second nitrogen gas nozzle 53 to the center part of the wafer W. |
