| 摘要 |
[Problem] To provide a means which is capable of reducing level difference defects such as dishing, while maintaining a high polishing rate, and which is also capable of improving storage stability with respect to a polishing composition that is used for the purpose of polishing an object that has a metal wiring layer. [Solution] A polishing composition which is used for the purpose of polishing an object that has a metal wiring layer, and which contains a surfactant and water. The surfactant is a compound represented by formula (1) or a salt thereof. In formula (1), each of A1-A3 independently represents a hydrogen atom, a methyl group, an ethyl group or a polyoxyalkylene aryl ether group, provided that at least one of the A1-A3 moieties is a polyoxyalkylene aryl ether group. This polyoxyalkylene aryl ether group is represented by formula (2) wherein Ar represents an optionally substituted aryl group having 6-20 carbon atoms; E represents an alkylene group having 1-3 carbon atoms; and n represents a number of 1-100. |
