发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which makes it possible to obtain a cured product having flexibility and insulation reliability, for example, insulation reliability in thickness direction (film thickness direction for a cured coating film).SOLUTION: The photosensitive resin composition comprises A) carboxyl group-containing photosensitive resin, (B) photopolymerization initiator, (C) (meth)acrylate monomer having a hydrophobic skeleton, (D) urethane (meth)acrylate monomer, (E) epoxy compound, and (F) inorganic cation exchanger.
申请公布号 JP2015007759(A) 申请公布日期 2015.01.15
申请号 JP20140092812 申请日期 2014.04.28
申请人 TAMURA SEISAKUSHO CO LTD 发明人 UESUGI NAOYUKI;KURAMOCHI MAYUKO;SAITO TAKAHIDE;KAKIUCHI NAOYA;TSUCHIYA MASAHIRO
分类号 G03F7/027;C08G59/18;G03F7/004;H05K3/28 主分类号 G03F7/027
代理机构 代理人
主权项
地址