TEMPORARILY FIXING AGENT OF SEMICONDUCTOR WAFER, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE BY USING THE AGENT

摘要

PROBLEM TO BE SOLVED: To provide a temporarily fixing agent of a semiconductor wafer, the agent allowing the semiconductor wafer to be removed easily while reducing damage to the semiconductor wafer and being able to shorten the time required for pyrolysis, and to provide a method for producing a semiconductor device by using the temporarily fixing agent.SOLUTION: The temporarily fixing agent of the semiconductor wafer is used when the semiconductor wafer is fixed temporarily to a supporting base material in order to process the semiconductor wafer and after the semiconductor wafer is processed, the semiconductor wafer is removed from the supporting base material by heating the semiconductor wafer-fixed supporting base material. The temporarily fixing agent of the semiconductor wafer contains a resin component the 50% weight loss temperature of which is lowered after the resin component is irradiated with an active energy ray.