| 摘要 |
<p>An object of the present invention is to improve, in a laminate and a flexible printed circuit board obtained using the laminate, (i) adhesiveness between a resin material and a plating layer and (ii) soldering heat resistance after moisture absorption. This object is attained by a method for producing a laminate including at least a polymer film, a to-be-plated layer containing at least a crystalline thermoplastic resin, and a plating layer, said method including the steps of: A) applying plating to a resin material including at least a polymer film and a to-be-plated layer containing at least a crystalline thermoplastic resin, in order to produce a laminate including at least the polymer film, the to-be-plated layer containing at least the crystalline thermoplastic resin, and a plating layer: and B) heating the laminate.</p> |
