发明名称 PHOTOSENSITIVE RESIN COMPOSITION FOR FORMING BIOCHIP, AND BIOCHIP
摘要 <p>It is intended to obtain a photosensitive resin composition that is capable of forming a highly fine pattern with a high aspect ratio while attaining the high adhesion of the pattern to a substrate, having low autofluorescence, and being exceedingly suitable for producing a biochip that causes exceedingly low damage on cultured cells. The photosensitive resin composition for forming a biochip of the present invention contains: an epoxy compound (A1) of a particular structure having an oxycyclohexane skeleton having an epoxy group; an epoxy compound (A2) of a particular structure which is a polyvalent carboxylic acid derivative having an epoxidized cyclohexenyl group; a cationic photoinitiator (B); and a solvent (C).</p>
申请公布号 EP2717097(A4) 申请公布日期 2015.01.14
申请号 EP20120793730 申请日期 2012.05.16
申请人 KYOTO UNIVERSITY;DAICEL CORPORATION 发明人 KOTERA, HIDETOSHI;OKONOGI, ATSUHITO;OHOKA, MASATAKA;MARUO, KATSUYA
分类号 G03F7/038;B01J19/00;B01L3/00;B81C1/00;C08G59/32;C08L63/00;G03F7/004;G03F7/029 主分类号 G03F7/038
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