发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION FOR FORMING BIOCHIP, AND BIOCHIP |
摘要 |
<p>It is intended to obtain a photosensitive resin composition that is capable of forming a highly fine pattern with a high aspect ratio while attaining the high adhesion of the pattern to a substrate, having low autofluorescence, and being exceedingly suitable for producing a biochip that causes exceedingly low damage on cultured cells. The photosensitive resin composition for forming a biochip of the present invention contains: an epoxy compound (A1) of a particular structure having an oxycyclohexane skeleton having an epoxy group; an epoxy compound (A2) of a particular structure which is a polyvalent carboxylic acid derivative having an epoxidized cyclohexenyl group; a cationic photoinitiator (B); and a solvent (C).</p> |
申请公布号 |
EP2717097(A4) |
申请公布日期 |
2015.01.14 |
申请号 |
EP20120793730 |
申请日期 |
2012.05.16 |
申请人 |
KYOTO UNIVERSITY;DAICEL CORPORATION |
发明人 |
KOTERA, HIDETOSHI;OKONOGI, ATSUHITO;OHOKA, MASATAKA;MARUO, KATSUYA |
分类号 |
G03F7/038;B01J19/00;B01L3/00;B81C1/00;C08G59/32;C08L63/00;G03F7/004;G03F7/029 |
主分类号 |
G03F7/038 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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