| 摘要 |
PROBLEM TO BE SOLVED: To enable to obtain in a chip bonding tool, a wide range of bonding pressures from a low pressure level of several grams or less to a high pressure level of several kilograms so as to provide a general use. SOLUTION: A piston 7 is inserted into a cylinder 4, so that there is formed a gap ranging from severalμms to several tens ofμms between a head 1 thereof and the cylinder 4, with a rod thereof being supported by a static pressure air bearing 10. In this structure, while compressed air is supplied to the cylinder 4, the air is discharged therefrom to move the piston 7 downward. At that time, a sliding resistance (frictional resistance) at the supporting point of the piston 7 is negligibly small, and therefore the piston 7 can be moved with a supply of low-level compressed air supplied to the cylinder tube 4. Accordingly, it is possible to obtain a low-level bonding pressure, for example, of several grams or less. On the other hand, by supplying high-level compressed air to the cylinder 4, a high-level bonding pressure of several kilograms can be obtained.
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