发明名称 光半導体封止用硬化性組成物及びこれを用いた光半導体装置
摘要 <p>There are provided an optical semiconductor sealing curable composition that provides a cured material having excellent transparency, and an optical semiconductor apparatus having an optical semiconductor device sealed using the cured material obtained by curing the optical semiconductor sealing curable composition. There is provided an optical semiconductor sealing curable composition containing: (A) a linear polyfluoro compound; (B) cyclic organosiloxane having an SiH group and a fluorine-containing organic group; (C) a platinum group metal catalyst; (D) cyclic organosiloxane having an SiH group, fluorine-containing organic group, and an epoxy group; and (E) cyclic organosiloxane having an SiH group, a fluorine-containing organic group, and a cyclic carboxylic acid anhydride residue.</p>
申请公布号 JP5653877(B2) 申请公布日期 2015.01.14
申请号 JP20110219927 申请日期 2011.10.04
申请人 发明人
分类号 C08L83/16;C08K5/5435;C08L71/00;C08L83/05;C08L83/12;H01L23/29;H01L23/31 主分类号 C08L83/16
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