| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent errors in chucking caused by concentric dislocations during spinning and to carry out a clean or dry step for both faces of a semiconductor substrate concurrently, with respect to a spinning chuck for holding and rotating the semiconductor substrate in a semiconductor manufacturing unit. SOLUTION: A circumferential edge of a semiconductor substrate 4 is held by an arm 12, so that the substrate 4 does not come off, even when the concentricity between the rotating center of the chuck 5 and the center of gravity of the substrate 4 is dislocated slightly. As a result, damage troubles on the wafer 4 can be restrained. In addition, a contact point between the arm 12 and the substrate 4 is located at a circumferential edge of the substrate 4, and the substrate 4 can be held as in a floated state, so both the faces of the substrate 4 can be cleaned or dried at the same time, and thereby workability in cleaning or drying work can be improved.</p> |
