Method of deposting uniform dielectric film deposition on textured surfaces

摘要

Uniformity of thin deposited layers on textured surfaces is enhanced by reducing the total surface area available to film deposition. The backside surface area of a semiconductor wafer is reduced prior to film deposition, thereby reducing the available surface to deposition when a deposition process is supply-limited. Reducing the backside surface area suppresses nonuniformities in thin film deposition when the deposition process is substantially supply-limited. The present invention is advantageous for improving uniformity of nitride capacitor dielectric layers deposited on textured electrodes.