Lead frame with power bar for semiconductor device

摘要

A lead frame for a packaged semiconductor device has multiple, configurable power bars that can be selectively electrically connected, such as with bond wires, to each other and/or to other leads of the lead frame to customize the lead frame for different package designs. One or more of the configurable power bars may extend into one or more cut-out regions in a die paddle of the lead frame, which allows for short bond wires to be used to connect the power bars to die pads of a semiconductor die mounted on the die paddle.

主权项

1. A lead frame for a semiconductor device, comprising:
a die paddle; a plurality of leads adjacent to the die paddle; a plurality of power bars adjacent to the die paddle, wherein:
a first power bar of the plurality of power bars comprises a radial lead segment connected to a tangential bar segment proximal to the die paddle; andthe tangential bar segment is directly connected to the die paddle; and a tape attached to the radial lead segment of the first power bar and at least one of the plurality of leads that is adjacent to the radial lead segment of the first power bar, wherein the radial lead segment of the first power bar is supported by the tape.