Apparatus and methods for coplanar printed circuit board interconnect

摘要

In some embodiments, an apparatus includes a first substrate, a second substrate, a first coupler, and a second coupler. The first substrate is formed from a first material and includes an electrical pad. The second substrate is formed from a second material and includes an electrical pad. The first coupler is configured to mechanically couple the first substrate to the second substrate without a soldered connection. The second coupler includes a first end portion, configured to be soldered to the electrical pad of the first substrate, and a second end portion, configured to be soldered to the electrical pad of the second substrate. The second coupler configured to electrically couple the first substrate to the second substrate.

主权项

1. An apparatus, comprising:
a first substrate formed of a first material, the first substrate being connected to a high speed electrical component; a second substrate formed of a second material different from the from the first material, the second substrate being connected to a non-high speed electrical component; a first coupler fixedly and mechanically connecting the first substrate and the second substrate without a solder connection; and a second coupler fixedly and electrically connecting the first substrate and the second substrate, the second coupler having a first end portion soldered to an electrical pad of the first substrate and having a second end portion soldered to an electrical pad of the second substrate.