| 发明名称 | High-voltage light-emitting device | ||
| 摘要 | The present invention relates to a high-voltage light-emitting device suitable for light-emitting diode chip array module. The device comprises a set of light emitting diode chips, about 18˜25 chips, deposited on a substrate by using a non-matrix arrangement. Through the adjustments, the high-voltage light-emitting device of the present invention has optimized luminous efficiency. | ||
| 申请公布号 | US8933469(B2) | 申请公布日期 | 2015.01.13 |
| 申请号 | US201213655534 | 申请日期 | 2012.10.19 |
| 申请人 | Formosa Epitaxy Incorporation | 发明人 | Feng Hui-Ching;Lee Chen-Hong;Cheng Wei-Kang;Pan Shyi-Ming |
| 分类号 | H01L29/18;H01L33/00 | 主分类号 | H01L29/18 |
| 代理机构 | Rosenberg, Klein & Lee | 代理人 | Rosenberg, Klein & Lee |
| 主权项 | 1. A light-emitting device, comprising: a substrate; and a set of light-emitting diode chips, disposed on the substrate and having a number about 18 to 25 chips; wherein the light-emitting diode chips have a mis-aligned arrangement, and the luminous area of the light-emitting diode chips is about 60% to 80% of the surface of the substrate, such that light outputted from side walls of the light-emitting diode chips used to enhance the lighting efficiency of the light-emitting device. | ||
| 地址 | Taoyuan County TW | ||