Repeated spin current interconnects

摘要

One embodiment includes a metal layer including first and second metal portions; a ferromagnetic layer including a first ferromagnetic portion that directly contacts the first metal portion and a second ferromagnetic portion that directly contacts the second metal portion; and a first metal non-magnetic interconnect coupling the first ferromagnetic portion to the second ferromagnetic portion. The spin interconnect conveys spin polarized current suitable for spin logic circuits. The interconnect may be included in a current repeater such as an inverter or buffer. The interconnect may perform regeneration of spin signals. Some embodiments extend spin interconnects into three dimensions (e.g., vertically across layers of a device) using vertical non-magnetic metal interconnects. Spin interconnects that can communicate spin current without repeated conversion of the current between spin and electrical signals enable spin logic circuits by reducing power requirements, reducing circuit size, and increasing circuit speed.

主权项

1. An apparatus comprising:
a substrate; a metal layer, on the substrate, including first and second metal portions that do not directly contact one another; a ferromagnetic layer, on the substrate, including a first ferromagnetic portion that directly contacts the first metal portion and a second ferromagnetic portion that directly contacts the second metal portion but not the first ferromagnetic portion; a first metal interconnect coupling the first ferromagnetic portion to the second ferromagnetic portion; and an isolation portion (a) between the first interconnect and a second interconnect, and (b) directly contacting the second ferromagnetic portion; wherein there is not another ferromagnetic layer directly contacting either of the first and second metal portions.