| 摘要 |
<p>There is described a cleaning apparatus for a surface (e.g., a radiation source assembly) in a fluid treatment system. A preferred embodiment of the cleaning apparatus comprises: a wiping element for contact with at least a portion of the surface; at least one cutting element connected to the wiping element for cutting elongate debris in contact with the surface; and a motive element for moving the carriage between a first position and a second position. This preferred embodiment of the present cleaning apparatus is particularly advantageous for removing elongate debris from one or more radiation source assemblies disposed in the fluid treatment system. The approach utilized in this preferred embodiment of the present cleaning apparatus is to include at least one cutting element which is moved along the exterior of the radiation source assembly. The cutting element is connected to a wiping element that is translated between a first position and a second position. As the wiping element is moved from the first position to the second position, it will tend to push the elongate debris toward a distal portion of the radiation source assembly. During this translation step, it is possible that some of the debris may be cut by the cutting element. As the wiping element approaches the distal portion of the radiation source assembly, it will tend to clamp down on the elongate debris and, as the force of movement is continually applied, the cutting element will cut the elongate debris. Once the elongate debris is cut, it will more readily fall away from the radiation source assembly and this action is facilitated by a flow of fluid past the radiation source assembly.</p> |
