INSERT AND APPARATUS FOR TESTING SEMICONDUCTOR PACKAGE INCLUDING THE SAME

摘要

The objective of the present invention is to stably perform a test and prevent damage to a solder ball in spite of some misalignment by alleviating an alignment problem in testing a semiconductor package. An insert of the present invention comprises: an insert body including a receiving unit to mount a semiconductor package which is an object to be tested; and a first socket coupled under the insert body. The first socket includes one or more plungers which are installed at predetermined intervals to be freely moved up and down, and the upper end of the plungers are in contact with a solder ball of the semiconductor package when the semiconductor package is tested after being mounted in the insert.