GUIDE VANE AND JETTING APPARATUS

摘要

The present invention comprises: a drift plate on which the structure of a drift member is devised to change the direction of the flow of molten solder; a semi-cylindrical plate (11) that has a predetermined inner shape and a predetermined height as illustrated in Fig. 1 and is erected on a predetermined substrate to change the direction of the flow of the molten solder; and a semi-cylindrical plate (12) that has a predetermined inner shape and a predetermined height and is disposed on the substrate (13) where the semi-cylindrical plate (11) is erected to change the direction of the flow of the molten solder. The semi-cylindrical plate (11) and the semi-cylindrical plate (12) are opposed to each other so that an inner surface of the semi-cylindrical plate (11) faces an end portion of the semi-cylindrical plate (12) and an inner surface of the semi-cylindrical plate (12) faces an end portion of the semi-cylindrical plate (11). According to the structure, the molten solder can be jetted to a target position, and the width direction distribution of the jetted height of the molten solder can be uniform.