发明名称 METHOD OF FORMING HIGH CURRENT-CARRYING CAPACITY YBaCuOFILMS ON GOLD BUFFER UNDERLAYER
摘要 FIELD: chemistry.SUBSTANCE: in the method of forming high current-carrying capacity YBaCuOfilms on a gold buffer underlayer, a gold contact pad is formed on a dielectric substrate before depositing YBaCuOfilms on the dielectric substrate. Targets made of gold and ceramic YBaCuOare sputtered using a laser with radiation wavelength of 1.06 mcm, pulse duration of 10-20 ns, pulse repetition frequency of 10 Hz and laser radiation power density of (5-7)·10W/cm. The method comprises preheating the gold target and substrate to temperature T=450-500°C, establishing pressure of 0.1-0.5 Pa, sputtering the gold target onto the substrate through a screen, placed 0.3-0.5 mm from the substrate, heating the YBaCuOtarget to T=600-700°C, heating the substrate to 800-840°C, establishing pressure of 50-100 Pa and sputtering the YBaCuOtarget onto the formed contact pads to thickness of 50-200 nm to form films with critical temperature of the superconducting junction T=88-89 K, width of the superconducting junction ?T= 2-3 K and critical current density J>10A/cm.EFFECT: obtaining superconducting films with high current-carrying capacity on a gold buffer underlayer, which provide high density of critical supercurrent density.6 dwg
申请公布号 RU2538931(C2) 申请公布日期 2015.01.10
申请号 RU20130120782 申请日期 2013.05.06
申请人 OBSHCHESTVO S OGRANICHENNOJ OTVETSTVENNOST'JU "INZHENERNYE RESHENIJA" 发明人 SEROPJAN GENNADIJ MIKHAJLOVICH;SYCHEV SERGEJ ALEKSANDROVICH;PETROV ALEKSANDR GENNAD'EVICH;FEDOSOV DENIS VIKTOROVICH
分类号 H01L39/24 主分类号 H01L39/24
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