| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin-based interlayer insulating adhesive expressing flame retardance with no halogens, excellent in heat resistance and storage stability and capable of being rapidly cured. SOLUTION: This interlayer insulating adhesive for multilayer printed wiring board comprises (1) a sulfur component-containing thermoplastic resin having 10<3> -10<5> weight average molecular weight, (2) an inorganic filler, (3) an epoxy resin having <=500 epoxy equivalence and (4) an epoxy resin-curing agent as essential components. |
