Wiring Board and Method of Manufacturing Wiring Board

摘要

A wiring board includes a first wiring layer including a first conductive layer and a second conductive layer coating a first surface and a side surface of the first conductive layer. A first insulating layer covers a first surface and a side surface of the second conductive layer so as to expose a second surface of the first conductive layer opposite to the first surface of the first conductive layer. A second wiring layer is stacked on a first surface of the first insulating layer and is electrically connected to the first wiring layer. The first surface and the side surface of the first conductive layer are smooth surfaces while the first surface and the side surface of the second conductive layer are roughened-surfaces.

主权项

1. A wiring board comprising:
a first wiring layer that includes a first conductive layer and a second conductive layer, the second conductive layer coating a first surface of the first conductive layer and a side surface of the first conductive layer, the first conductive layer and the second conductive layer being respectively made of a first conductive material and a second conductive material differing from the first conductive material; a first insulating layer that is an outermost layer of the wiring board, the first insulating layer coating a first surface of the second conductive layer and a side surface of the second conductive layer so as to expose a second surface of the first conductive layer which is opposite to the first surface of the first conductive layer; a second wiring layer that is stacked on a first surface of the first insulating layer and that is electrically connected to the first wiring layer; and the first surface and the side surface of the first conductive layer being smooth surfaces while the first surface and the side surface of the second conductive layer being roughened-surfaces.