发明名称 |
MICROPHONE PACKAGE WITH INTEGRATED SUBSTRATE |
摘要 |
MEMS microphone packages are described that include an ASIC integrated in the base substrate of the package housing. Methods of manufacturing the same and methods for separating individual microphone packages from wafer form assembly arrays are also described. |
申请公布号 |
WO2014160006(A3) |
申请公布日期 |
2015.01.08 |
申请号 |
WO2014US25613 |
申请日期 |
2014.03.13 |
申请人 |
ROBERT BOSCH GMBH;SALMON, JAY |
发明人 |
SALMON, JAY |
分类号 |
H04R1/04;B81C1/00;H04R1/28;H04R19/00 |
主分类号 |
H04R1/04 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|