Method and Structure of Packaging Semiconductor Devices

摘要

A method for fabricating packaged semiconductor devices; attaching a batch-sized metallic grid with openings onto an adhesive tape having an insulating clear core covered by a layer of UV-releasable adhesive, the openings sized larger than a semiconductor chip; attaching a semiconductor chip onto the tape of each window, the chip terminals facing the adhesive surface; laminating insulating material of low coefficient of thermal expansion to fill gaps between each chip and respective grid; turning over assembly to place a carrier under backside of chips and lamination and to remove the tape; plasma-cleaning the assembly front side and sputtering uniform at least one metal layer across the assembly; optionally plating metal layers; and patterning the metal layers to form rerouting traces and extended contact pads for assembly.

主权项

1. A method for fabricating packaged semiconductor devices, comprising:
providing a flat carrier sheet secured in a frame to restrain warpage, the carrier having an insulating core of clear laminate material and a surface covered by a layer of a UV-releasable adhesive, the frame having lateral dimensions comparable to a semiconductor wafer; attaching the surface of a metallic window frame onto the adhesive panel surface, the frame including a plurality of rectangular windows bordered by a metal grid and sized larger than a semiconductor chip; attaching a plurality of semiconductor chips to the adhesive carrier surfaces in respective windows, the chip terminals facing the adhesive surface; compression-molding a compliant insulating material to cohesively fill gaps between chips and grid sidewalls, the material having a coefficient of thermal expansion approaching the coefficient of the semiconductor chips, thereby creating an assembly; using UV irradiation, separating the carrier sheet and frame from the assembly, thereby exposing the surfaces of the chips with terminals and the grid metals; plasma-cleaning the carrier and attached chips uniformly in an equipment for sputtering metals; and sputtering, at uniform energy and rate and while cooling the assembly, at least one metal layer adhering to the assembly of chips and grid metal.