发明名称 |
COPPER ALLOY FOR ELECTRICAL AND ELECTRONIC EQUIPMENT, COPPER ALLOY THIN SHEET FOR ELECTRICAL AND ELECTRONIC EQUIPMENT, AND COMPONENT AND TERMINAL FOR ELECTRICAL AND ELECTRONIC EQUIPMENT |
摘要 |
A copper alloy for electrical and electronic equipment comprising 1.0-5.0 mass% Ni and 0.1-1.5 mass% Si, with the remainder being Cu and unavoidable impurities. Said copper alloy for electrical and electronic equipment has a composition having an Ni/Si (mass ratio) of 2.0-6.0. The special grain boundary length ratio (L&sgr;/L), being the ratio between the sum (L&sgr;) of each grain boundary length for &Sgr;3, &Sgr;9, &Sgr;27a, and &Sgr;27b and the length (L) of all crystal grain boundaries is at least 30%. The ratio (R{200}) for the X-ray diffraction intensity of the {200} plane in the material surface is at least 0.2. |
申请公布号 |
WO2015001683(A1) |
申请公布日期 |
2015.01.08 |
申请号 |
WO2013JP70336 |
申请日期 |
2013.07.26 |
申请人 |
MITSUBISHI MATERIALS CORPORATION |
发明人 |
MAKI KAZUNARI;MATSUNAGA HIROTAKA |
分类号 |
C22C9/06;C22C9/00;C22C9/05;C22F1/08 |
主分类号 |
C22C9/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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