CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

A circuit board includes a substrate and a through via. The substrate has a first surface and a second surface opposite to the first surface. The substrate includes circuit layers and insulation layers. The insulation layers are sandwiched between the circuit layers. The through via goes through the substrate and has portions defining a first portion and a second portion. The first portion of the through via is coated with a first metal layer and electrically connected to at least one of the circuit layer by the first metal layer. The second portion of the through via is coated with a second metal layer and electrically connected to at least one of the circuit layer by the second metal layer. The first and second portions are electrically insulted, and the diameter of the second portion is larger than that of the first portion.

主权项

1. A circuit board comprising:
a substrate having a first surface and a second surface opposite to the first surface, wherein the substrate includes two outer circuit layers, a plurality of circuit layers and a plurality of insulation layers, the circuit layers and the insulation layers are alternatively sandwiched between the two outer circuit layers; and a through via going through the substrate, wherein the through via opens on the outer circuit layers and has portions defining a first portion and a second portion, the first portion of the through via is coated with a first metal layer and electrically connected to at least one of the circuit layer by the first metal layer, the second portion of the through via is coated with a second metal layer and electrically connected to at least one of the circuit layer by the second metal layer, the first and second portions are electrically insulted, and the diameter of the second portion is larger than that of the first portion.