METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

A method for manufacturing a semiconductor device, which comprises: a step (A) wherein a semiconductor chip is flip-chip bonded to a circuit formation surface of a semiconductor wafer; a step (B) wherein a package is formed by embedding the semiconductor chip, which has been flip-chip bonded to the semiconductor wafer, in an encapsulation sheet; a step (C) wherein the back surface of the semiconductor chip is exposed to the outside by grinding the encapsulation sheet of the package; and a step (D) wherein the package, from which the back surface of the semiconductor chip is exposed, is diced. This method for manufacturing a semiconductor device also comprises a step wherein the encapsulation sheet is subjected to laser marking after the step (B) and before the step (C) and/or after the step (C) and before the step (D).