发明名称 |
HOUSING FOR ELECTRONIC COMPONENTS |
摘要 |
The invention relates to a housing for electronic components with the housing comprising at least a front housing part and a rear housing part. The front housing part and the rear housing part are arranged to be sealed by means of a sealing gasket upon attaching the front housing part to the rear housing part. The housing comprises at least one ventilation opening to prevent build-up of negative pressure inside the housing, where the ventilation opening is covered by a protective covering comprising a through opening. The through opening is arranged to allow water to flow through the through opening, thereby preventing a build up of pressure inside the protective covering. A method for manufacturing a housing according to the invention is also disclosed. |
申请公布号 |
EP2820928(A1) |
申请公布日期 |
2015.01.07 |
申请号 |
EP20120706255 |
申请日期 |
2012.02.28 |
申请人 |
TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) |
发明人 |
HILLSTRÖM, PER;FÄRDIG, MIKAEL;FREDRIKSSON, DANIEL;OLSSON, SOFIA |
分类号 |
B32B38/00;H05K5/02;H05K5/06;H05K9/00 |
主分类号 |
B32B38/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|