发明名称 半導体装置
摘要 The semiconductor device includes a first wiring; a second wiring; a third wiring; a fourth wiring; a first transistor having a first gate electrode, a first source electrode, and a first drain electrode; and a second transistor having a second gate electrode, a second source electrode, and a second drain electrode. The first transistor is formed on or in a substrate including a semiconductor material. The second transistor includes an oxide semiconductor layer.
申请公布号 JP5647873(B2) 申请公布日期 2015.01.07
申请号 JP20100262859 申请日期 2010.11.25
申请人 发明人
分类号 H01L21/8242;G11C11/405;H01L21/336;H01L21/8247;H01L27/10;H01L27/108;H01L27/115;H01L29/786;H01L29/788;H01L29/792 主分类号 H01L21/8242
代理机构 代理人
主权项
地址