| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a technology of bonding objects to be bonded, which are not bonded easily by simply applying ultrasonic vibration, well by applying ultrasonic vibration in a state where a foil-like conductive material is interposed between both metal joints. <P>SOLUTION: When bonding a lead frame 123 (a metal joint 123a) and a glass epoxy substrate 124 (an electrode pattern 124a) which are not bonded well by simply applying ultrasonic vibration, ultrasonic vibration is applied in a state where a metal foil-like conductive material 50 is interposed between the metal joint 123a and the electrode pattern 124a. Since the ultrasonic vibration is applied reliably to the junction interface formed by both metal joints coming in contact, respectively, with both sides of the foil-like conductive material 50, the lead frame 123 having the metal joint 123a and the glass epoxy substrate 124 having the electrode pattern 124a can be bonded well. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
