| 摘要 |
PROBLEM TO BE SOLVED: To provide an expanding method, or the like, capable of preventing adhesion of silicon waste to the principal surface of a chip more strongly when a semiconductor wafer is divided. SOLUTION: The method of producing chips by expanding a semiconductor wafer includes a first step for pasting an adhesive sheet, formed of a stretchable material and having a hole formed therein, to the rear surface of the semiconductor wafer, and a second step for stretching the adhesive sheet while directing the rear surface of the semiconductor wafer to which the adhesive sheet is pasted vertically upward, and dividing the semiconductor wafer into a plurality of chips. In the second step, a fluid is fed from the rear surface toward the principal surface of the semiconductor wafer through the hole of the stretched adhesive sheet and the gaps of the plurality of chips. COPYRIGHT: (C)2012,JPO&INPIT |
