| 摘要 |
PROBLEM TO BE SOLVED: To provide a film deposition device and a film deposition method capable of evaporating a film deposition material while supplying a prescribed amount of the film deposition material. SOLUTION: The inside of a vacuum tank 11 is evacuated, an evaporation vessel 21 connected to a discharge vessel 16 is heated to be the evaporation temperature of a film deposition material or higher and be the evaporation temperature of the solvent of a liquid material containing the film deposition material or higher, the prescribed amount of the liquid material is jetted into the evaporation vessel 21, and the film deposition material is stuck to a vaporization member 22 arranged inside the evaporation vessel 21. Then, after discharging the vapor of the solvent from the evaporation vessel 21, the vaporization member 22 is heated to be the evaporation temperature of the film deposition material or higher, the film deposition material stuck to the vaporization member 22 is evaporated, the vapor of the film deposition material is made to flow into the discharge vessel 16, and the vapor of the film deposition material is discharged from the hole 17 of the discharge vessel 16 and made to reach a substrate 15 arranged inside the vacuum tank 11. COPYRIGHT: (C)2012,JPO&INPIT |
