Thin film transistor with anti-diffusion area that prevents metal atoms and/or ions from source/drain electrodes from shortening the channel length and display substrate having the thin film transistor

摘要

A thin film transistor includes a semiconductor pattern disposed on a substrate and a semiconductor pattern portion with a conductive or nonconductive characteristic, and a anti-diffusion portion on a side of the semiconductor pattern portion to prevent metal ions from being diffused along the semiconductor pattern portion. A first insulating layer covers the semiconductor pattern and has a first contact hole exposing a first region of the semiconductor pattern portion and a second contact hole exposing a second region of the semiconductor pattern portion. A gate electrode is disposed on the first insulating layer. A second insulating layer covers the gate electrode and has a third contact hole exposing the first region and a fourth contact hole exposing the second region. A source electrode is formed on the second insulating layer and connected to the first region, and a drain electrode is formed on the second insulating layer and connected to the second region.

主权项

1. A thin film transistor with anti-diffusion portion comprising:
a substrate; a semiconductor pattern including a source region, a drain region, a channel region and an anti-diffusion portion formed on the substrate; a first insulating layer on the semiconductor pattern; a gate electrode on the first insulating layer; a second insulating layer on the gate electrode; an interlayer insulating layer pattern formed on the second insulating layer pattern; a source electrode and a drain electrode on the second insulating layer and electrically connected to the source region and the drain region through contact holes of the first and second insulating layer; wherein the anti-diffusion portion protrudes from the source region, the drain region, or both and comprises a plurality of thin extensions, wherein a portion of metal ions from the source electrode and the drain electrode to the channel portion of the semiconductor pattern portion is diffused to the anti-diffusion portion, wherein the anti-diffusion portion reduces a diffusion of metal ions provided to the channel portion of the semiconductor pattern portion by conducting the diffusion of at least a portion of the metal ions from the source electrode and the drain electrode away from the channel portion.