Thermoelectric-enhanced air and liquid cooling of an electronic system

摘要

Thermoelectric-enhanced air and liquid cooling of an electronic system is provided by a cooling apparatus which includes a liquid-cooled structure in thermal communication with an electronic component(s), and liquid-to-liquid and air-to-liquid heat exchangers coupled in series fluid communication via a coolant loop, which includes first and second loop portions coupled in parallel. The liquid-cooled structure is supplied coolant via the first loop portion, and a thermoelectric array is disposed with the first and second loop portions in thermal contact with first and second sides of the array. The thermoelectric array operates to transfer heat from coolant passing through the first loop portion to coolant passing through the second loop portion, and cools coolant passing through the first loop portion before the coolant passes through the liquid-cooled structure. Coolant passing through the first and second loop portions passes through the series-coupled heat exchangers, one of which functions as heat sink.

主权项

1. A cooling apparatus comprising;
a liquid-cooled structure, the liquid-cooled structure being configured to couple to at least one electronic component to be cooled; a coolant loop, the coolant loop comprising a first loop portion and a second loop portion, the first loop portion and the second loop portion being parallel portions of the coolant loop, and the liquid-cooled structure being coupled in fluid communication with the first loop portion of the coolant loop; a liquid-to-liquid heat exchanger; an air-to-liquid heat exchanger, wherein the liquid-to-liquid heat exchanger and the air-to-liquid heat exchanger are coupled in series fluid communication via the coolant loop, and wherein coolant egressing from the liquid-to-liquid heat exchanger passes, via the coolant loop, through the air-to-liquid heat exchanger; and a thermoelectric array comprising at least one thermoelectric module, the thermoelectric array being disposed with the first loop portion of the coolant loop at least partially in thermal contact with a first side of the thermoelectric array, and the second loop portion of the coolant loop at least partially in thermal contact with a second side of the thermoelectric array, wherein the thermoelectric array operates to transfer heat from coolant passing through the first loop portion to coolant passing through the second loop portion, the thermoelectric array cooling coolant passing through the first loop portion before the coolant passes through the liquid-cooled structure, and after passing through the liquid-cooled structure, the coolant passing through the first loop portion and the coolant passing through the second loop portion pass through the liquid-to-liquid heat exchanger and air-to-liquid heat exchanger, wherein one of the liquid-to-liquid heat exchanger or the air-to-liquid heat exchanger operates as heat sink for the coolant loop, dependent on a mode of operation of the cooling apparatus.