发明名称 |
Non-volatile memory device and method for fabricating the same |
摘要 |
A non-volatile memory device includes a channel layer vertically extending from a substrate, a plurality of inter-layer dielectric layers and a plurality of gate electrodes that are alternately stacked along the channel layer, and an air gap interposed between the channel layer and each of the plurality of gate electrodes. The non-volatile memory device may improve erase operation characteristics by suppressing back tunneling of electrons by substituting a charge blocking layer interposed between a gate electrode and a charge storage layer with an air gap, and a method for fabricating the non-volatile memory device. |
申请公布号 |
US8928063(B2) |
申请公布日期 |
2015.01.06 |
申请号 |
US201213618182 |
申请日期 |
2012.09.14 |
申请人 |
SK Hynix Inc. |
发明人 |
Kim Min-Soo;Sheen Dong-Sun;Pyi Seung-Ho;Whang Sung-Jin |
分类号 |
H01L29/792;H01L21/20 |
主分类号 |
H01L29/792 |
代理机构 |
IP & T Group LLP |
代理人 |
IP & T Group LLP |
主权项 |
1. A non-volatile memory device, comprising:
a channel layer vertically extending from a substrate; a plurality of inter-layer dielectric layers and a plurality of gate electrodes that are alternately stacked along the channel layer; and a memory layer interposed between the channel layer and each gate electrode, wherein the memory layer includes a charge storage laver, a tunnel insulation layer interposed between the charge storage layer and the channel layer, and an air gap interposed between the charge storage layer and each gate electrode. |
地址 |
Gyeonggi-do KR |