LID FOR AIRTIGHT SEALING, METHOD OF MANUFACTURING LID FOR AIRTIGHT SEALING AND ELECTRONIC COMPONENT HOUSING PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a lid material for airtight sealing which suppresses occurrence of crack and void, even if a clad material including a silver solder layer is formed into a box shape including a recess.SOLUTION: A lid material 10 (lid material for airtight sealing) for use in a package 100 including a base 30 on which an electronic component 40 is arranged is composed of a clad material 20 including a silver solder layer 21 containing Ag and Cu, and a Fe layer 22 bonded onto the silver solder layer 21, and composed by using Fe or an Fe alloy. The lid material 10 is formed into a box-shape including a recess 13, by bending the clad material 20.SELECTED DRAWING: Figure 3