ADHESIVE COMPOSITION, ADHESIVE TAPE, AND METHOD FOR PROCESSING WAFER

摘要

PROBLEM TO BE SOLVED: To provide an adhesive composition that has high initial adhesive force and can fix an adherend and that can be easily peeled by irradiation with light while leaving no glue residue, an adhesive tape using the above adhesive composition, and a method for processing a wafer by using the adhesive composition.SOLUTION: The adhesive composition comprises an adhesive component, a positive resist agent that decomposes at least a part of the adhesive component by irradiation with light, and a gas generator that generates gas by irradiation with light.SELECTED DRAWING: None