Automated optical inspection of unit specific patterning

摘要

A method of automated optical inspection (AOI) for a plurality of unique semiconductor packages can comprise providing a plurality of semiconductor die formed as a reconstituted wafer. A plurality of unit specific patterns can be formed by forming a unit specific pattern over each of the plurality of semiconductor die, wherein each of the unit specific patterns is customized to fit its respective semiconductor die. A plurality of images can be acquired by acquiring an image for each of the plurality of unit specific patterns. A plurality of unique reference standards can be created by creating a unique reference standard for each of the plurality of unit specific patterns. Defects can be detected in the plurality of unit specific patterns by comparing one of the plurality of unique reference standards to a corresponding one of the plurality of images for each of the plurality of unit specific patterns.

主权项

1. A method of automated optical inspection (AOI) for a plurality of unique semiconductor packages comprising:
providing a plurality of semiconductor die formed as a reconstituted wafer; forming a plurality of unit specific patterns by forming a unit specific pattern over each of the plurality of semiconductor die, wherein each of the unit specific patterns is customized to fit its respective semiconductor die; acquiring a plurality of images by acquiring an image for each of the plurality of unit specific patterns; creating a plurality of unique reference standards by creating a unique reference standard for each of the plurality of unit specific patterns; detecting defects in the plurality of unit specific patterns by comparing one of the plurality of unique reference standards to a corresponding one of the plurality of images for each of the plurality of unit specific patterns; and singulating the reconstituted wafer to form the plurality of unique semiconductor packages.