发明名称 RESIN COATING DEVICE AND RESIN COATING METHOD IN LED PACKAGE MANUFACTURING SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide a resin coating device and a resin coating method in an LED package manufacturing system capable of increasing the production efficiency by reducing the time for properly correcting the resin coating amount and capable of preventing production of a defective product caused by using an improper correction value.SOLUTION: In a resin coating which is used for manufacturing an LED package, before measuring the luminescence characteristic, which is performed after test-coating a resin 8 to a concave portion of an emboss part of a translucent member 43 to measure the luminescence characteristic, an air blow step is carried out in which an air blow nozzle 33b blows a gas to uniform the surface of the resin 8 which is test-coated on the translucent member 43. With this, the surface of the test-coated resin 8 can be swiftly stabilized and the uniform coating thickness at the measurement portion is obtained.
申请公布号 JP2015002186(A) 申请公布日期 2015.01.05
申请号 JP20130124364 申请日期 2013.06.13
申请人 PANASONIC CORP 发明人 TSUNEMASA SATOSHI
分类号 H01L33/50;H01L33/52 主分类号 H01L33/50
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