发明名称 ADHESIVE COMPOSITION
摘要 <p>PROBLEM TO BE SOLVED: To provide an adhesive composition excellent in whitening resistance under heat and humidity for avoiding whitening under a hot and humid condition, in low dielectric constant for preventing transmission delay at an electronic apparatus and in level difference followability.SOLUTION: An adhesive composition includes acrylic polymer obtained by polymerization of monomer including: 20-99 wt.% (meth)acrylic monomer having a substituent group having 10-24 carbon atoms; and 0.1-7 wt.% amide group-containing monomer. The weight average molecular weight of the acrylic polymer is less than 400 thousand.</p>
申请公布号 JP2015000874(A) 申请公布日期 2015.01.05
申请号 JP20130124386 申请日期 2013.06.13
申请人 AICA KOGYO CO LTD 发明人 SUGI RYUJI
分类号 C09J133/10;C08F220/18;C09J11/06;C09J133/08 主分类号 C09J133/10
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