| 摘要 |
<p>Provided is a cleaning method capable of removing a reaction product deposited on an electrostatic chuck and including titanium (Ti). The cleaning method for removing a deposit containing titanium and attached to the electrostatic chuck in a substrate processing apparatus including at least an electrostatic chuck to receive a substrate and performing a plasma process on the substrate includes: a first process of reducing the deposit containing titanium by plasma of process gas containing a reducing gas; a second process of removing the reduced deposit containing titanium by the first process by plasma of process gas containing a fluorine-based gas; and a third process of removing a fluorocarbon-based deposit deposited on the electrostatic chuck through the second process by plasma of process gas containing oxygen.</p> |
