| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical semiconductor device capable of connecting a package, which houses an optical semiconductor element, to an optical connector at low cost with a highly reliable structure and further capable of miniaturization.SOLUTION: An optical semiconductor device 1 includes: a package 10 that houses an optical semiconductor chip 17; a receptacle 20 that is connected to the package 10; and an insulating connection member 30 that is inserted between the package 10 and receptacle 20 and contains at least chrome (Cr), aluminium (Al), and iron (Fe). |
