发明名称 A solution for etching metallic layer and a method for etching metallic layer using the same
摘要 <p>PURPOSE: A solution for etching a metallic layer is provided to ensure excellent surface and high-speed etching rate of edge profiles, to ensure enough etching effect, to control reaction heat of a process, and to increase productivity. CONSTITUTION: A solution for etching a metallic layer comprises ferric chloride(FeCl3), cupric chloride(CuCl2), a first acid containing chlorine ions, a second acid with viscosity higher than the first acid, and a hydrophilic solvent. The second acid has a viscosity of 20 cP or more, and is phosphoric acid or sulfuric acid. The hydrophilic solvent is one selected from the group consisting of water, ethanol, methanol and their mixture. The first acid is the acid mixed with neutral chloride or hydrochloric acid.</p>
申请公布号 KR101478809(B1) 申请公布日期 2015.01.05
申请号 KR20080051778 申请日期 2008.06.02
申请人 发明人
分类号 C09K13/04 主分类号 C09K13/04
代理机构 代理人
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