| 摘要 |
The present invention provides a semiconductor package with improved reliability. The semiconductor package according to one embodiment of the present invention includes a package substrate which includes chip regions, a separation region which is formed between the chip regions, and an edge region except for the chip regions and the separation region, and semiconductor chips which are arranged on the chip regions of the package substrate. The package substrate includes a top layer which is adjacent to the semiconductor chips, a bottom layer which includes chip ball lands which are arranged on the chip regions, and an intermediate layer which is arranged between the top layer and the bottom layer. The intermediate layer includes through holes which are on the edge region and/or the chip regions except the separation region. The signal patterns are in contact with the signal patterns through the through holes. |
