METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE PACKAGE

摘要

According to an embodiment of the present invention, the present invention relates to a method for manufacturing semiconductor light emitting device package and includes the steps of: disposing a wafer on which a semiconductor lamination body is formed for a plurality of light emitting devices; applying hardening resin to a surface, on which an electrode is disposed, among the semiconductor lamination body, where in the electrode is disposed on each light emitting device area of the semiconductor lamination layer; a forming support structure for the semiconductor lamination layer by hardening the hardening resin; forming a penetration hole on the support structure to expose the electrode; and forming a connection electrode on the support structure to be connected to the electrode exposed to the penetration hole. The present invention improves the productivity of the package by simplifying the entire process.